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Below are the definitions for a number of abbreviations used throughout TL Industries' web site.
BGA (Ball Grid Array) An area array IC package with solderball connections. Back COB (Chip On Board) A direct chip attachment method to mount an unencapsulated die to a printed circuit board (or MCM-L). Typically wire bonded and glob topped with epoxy encapsulate for environmental protection. Back DFA (Design For Assembly) Design For Assembly focuses on the need to minimize the cost of assembly of a product. DFA is similar to DFM except it only takes into account the assembly of the product and does not consider other steps of the complete manufacturing process such as parts procurement and testing. Back DFM (Design For Manufacture) Design For Manufacture focuses on the need to minimize the cost of the complete manufacturing process including parts procurement, assembly and testing. While DFM is similar to DFA, DFA is only a small part of the complete DFM process. Back DFX (Design For Exellence) Many "Design for" initiatives such as Design for Assembly, Design for Cost, Design for Manufacturing, Design for Test, Design for Logistics, Design for Performance, and so on are now being referred to as Design for Excellence (DFX). The primary objective is to get the overall design right at the lowest cost. Back FC (Flip Chip) A semiconductor chip that is flipped (face down) and connected to a package, substrate, or board. The chip typically has bumps (on the bond pads) in a peripheral or array design. A process version developed by IBM is referred to as "C4" bonding (Controlled Collapse Chip Connection). Back MCM (Multi-Chip Modules) A functional collection of stand-alone blocks of silicon in either "bare" die form or some other surface-mountable micro packaging, mounted on various substrates from printed circuit boards to ceramic and thin film structures and delivered as a highly integrated module. Back MCM-D (Multi-Chip Modules-Deposited) Multichip Module that utilizes a silicon substrate with deposited thin films. Back MCM-L (Multi-Chip Modules-Laminated) Low-cost MCMs that use printed circuit board-like organic materials as substrates. Back PTH (Pin Through Hole) A technique for populating circuit boards in which component leads are inserted into plated through-holes. Often abbreviated to "through-hole" or "thru-hole". When all of the components have been inserted, they are soldered to the board, usually using a wave soldering technique. Back SMT (Surface Mount Technology) A technique for populating circuit boards in which packaged components are mounted directly onto the surface of the circuit board. A layer of solder paste is screen printed onto the pads and the components are attached by pushing their leads into the paste. When all of the components have been attached, the solder paste is melted using either reflow soldering or vapor-phase soldering. Back TAB (Tape Automated Bonding) A process in which transparent flexible tape has tracks created on its surface. Silver-loaded epoxy is screen printed on the substrate at the site where the device is to be located and onto the pads to which the device's leads are to be connected. The reel of TAB tape is fed through an automatic machine which pushes the device and the TAB leads into the epoxy. When the silver-loaded epoxy is cured using reflow soldering or vapor-phase soldering, it forms electrical connections between the TAB leads and the pads on the substrate. Back
CE CE certification refers to a product’s eligibility to be sold in the European Union. If an electronics manufacturer wants to sell their products to any of the countries in the European Economic Area they must obtain CE certification. A product bearing the CE Mark has been tested to all of the relevant standards that the EU demands. Back CSA (Canadian Standards Association) CSA is Canada’s largest standards development and certification organization. CSA was established in 1919 and is an independent, non-government, not for profit association. CSA certification indicates a product has been evaluated under the CSA’s formal system and that it complies with applicable standards. Back FCC (Federal Communications Commission) The FCC is responsible for rating electronic equipment as either Class A or Class B. The ratings indicate how much radiation electronic equipment emits: this rating process is often referred to as "certification." Class A certification means they are suitable for office use. Class B certification means they are suitable for anywhere, including the home, but must pass more stringent tests. Class B indicates that the machine’s radio frequency (RF) emissions are so low that they do not interfere with other devices such as radios and TVs. Many customers, especially large corporate customers, will only accept FCC rated systems. Back ISO 9001 - Quality System - Model for quality assurance in design / development, production, installation and servicing. The purpose of ISO 9001 is to ensure that customers requirements are met, and to improve the way in which our company does so. In order to do that, ISO 9001 requires that certain aspects of our business are under control. These include the planning of processes for production of products or provision of services, purchasing activities, staff training, improvement of processes, etc, etc. (ISO Web Site) Back ISO 9002 - Quality System - Model for quality assurance in production, installation and servicing. ISO 9002 is a subset of ISO 9001 not requiring processes for design and development. Back MIL (Military Specifications) A guide in determining the quality requirements of products used by the military services, published by the United States Department of Defense. Back TUV Technischer Uberwachungs-Verein - A German organization similar to U.L. that tests and certifies products for safety. Back UL (Underwriters Laboratories) UL is the leading third-party certification organization in the United States and the largest in North America. As a not for profit product safety organization, UL has been evaluating products in the interest of public safety since 1894. When a product meets the standards for safe operation set by UL, the product is rated as UL Listed and has meet UL’s rigorous standards for safe operation. Back
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