TL manufacturers through-hole, surface mount and hybrid assemblies at one of three electronics facilities.

The automation area is the first stage for the printed circuit board assembly process. Surface mount, through-hole axial and DIP assembly processes are performed in this area. Once the printed circuit boards are processed through the automation area they are issued to the final assembly area, where operator assisted cut and clinch machines are used to install the odd form components before the wave soldering operation. After wave soldering, the assemblies receive any components that must be hand soldered before they are issued to the Test Department for the specified test procedure.

Once the manufacturing cycle is completed the assemblies are reviewed for conformance and are issued to the Shipping Department where they are shipped, according to the customer’s specifications

Manufacturing Technologies

Surface Mount